SUBSTRATE CONTACT ANALYSIS

Patent №

US 7,013,192

Granted

2006-03-14

Filed 2004

Owner

LSI LOGIC CORPORATION

Lab

AI components

3

planning · evo · hardware

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

10867014

A method of analyzing substrate yield, where a substrate yield map and a substrate contact map are selected and overlaid to produce a composite map. First elements of the substrate yield map are compared to second elements of the substrate contact map to determine a degree of correlation between the first elements and the second elements. Additional substrate contact maps are repeatedly selected and the first elements of the substrate yield map are compared to the second elements of the additional substrate contact maps, and a degree of correlation between the first elements and each of the second elements for the additional substrate contact maps is determined and reported. The composite map having a highest degree of correlation between the first elements and the second elements is presented, and all composite maps that have at least a desired degree of correlation between the first elements and the second elements are presented.

PlanningEvolutionary computationAI hardwareG05B 19/41875G05B 2219/37224G05B 2219/45031Y02P 90/02

AI classification

AI hardware0.99
Evolutionary computation0.97
Planning0.95
Vision0.38
Machine learning0.10
Knowledge representation0.01
Natural language0.01
Speech0.00

Ownership

LSI LOGIC CORPORATION

assignment · 154740972

Assignors

WHITEFIELD, BRUCE J., ABERCROMBIE, DAVID A.

On an employer assignment, the assignors are typically the inventors.

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