Patent №
US 7,013,192
Granted
2006-03-14
Filed 2004
Owner
LSI LOGIC CORPORATION
Lab
—
AI components
3
planning · evo · hardware
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
10867014
A method of analyzing substrate yield, where a substrate yield map and a substrate contact map are selected and overlaid to produce a composite map. First elements of the substrate yield map are compared to second elements of the substrate contact map to determine a degree of correlation between the first elements and the second elements. Additional substrate contact maps are repeatedly selected and the first elements of the substrate yield map are compared to the second elements of the additional substrate contact maps, and a degree of correlation between the first elements and each of the second elements for the additional substrate contact maps is determined and reported. The composite map having a highest degree of correlation between the first elements and the second elements is presented, and all composite maps that have at least a desired degree of correlation between the first elements and the second elements are presented.
AI classification
Ownership
LSI LOGIC CORPORATION
assignment · 154740972
Assignors
WHITEFIELD, BRUCE J., ABERCROMBIE, DAVID A.
On an employer assignment, the assignors are typically the inventors.