MEMORY DEVICE AND ITS MANUFACTURING METHOD

Patent №

US 7,187,575

Granted

2007-03-06

Filed 2004

Owner

SEIKO EPSON CORPORATION

Lab

AI components

1

hardware

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

10858498

A memory device includes a semiconductor substrate, a transistor formed by using the semiconductor substrate, and a capacitor connected to the semiconductor substrate. Changes in electric conductivity of the semiconductor substrate are used as different data, and the transistor reads the data. By changing the amount of charge stored in the capacitor, a density of carriers (electrons) of the semiconductor substrate is changed.

AI hardwareH10D 30/701H10D 64/033H10D 86/00

AI classification

AI hardware1.00
Natural language0.01
Vision0.00
Evolutionary computation0.00
Machine learning0.00
Planning0.00
Knowledge representation0.00
Speech0.00

Ownership

SEIKO EPSON CORPORATION

assignment · 160340422

Assignors

KIJIMA, TAKESHI, INOUE, SATOSHI

On an employer assignment, the assignors are typically the inventors.

From the same owner

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