WAFER-BASED PLANNING METHODS AND SYSTEMS FOR BATCH-BASED PROCESSING TOOLS

Patent №

US 7,206,653

Granted

2007-04-17

Filed 2005

Owner

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Lab

AI components

1

planning

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

11288489

Computer-implemented wafer-based planning methods for batch-based processing tools. Tool groups are appended in a tool group level of planning data provided by a MES for converting planning data from batch-based to wafer-based data. The planning data with appended tool group is applied to dispatch processing tools.

AI classification

Planning1.00
Evolutionary computation0.18
Machine learning0.10
AI hardware0.03
Knowledge representation0.03
Natural language0.00
Speech0.00
Vision0.00

Ownership

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

assignment · 172920508

Assignors

OU, MING-FENG, FANG, GWO-CHIANG, CHANG, CHAO-FAN, CHEN, JU-KAU, WU, OLIVER

On an employer assignment, the assignors are typically the inventors.

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