INSTRUCTION SET WITH THERMAL OPCODE FOR HIGH-PERFORMANCE MICROPROCESSOR, MICROPROCESSOR, AND METHOD THEREFOR

Patent №

US 7,313,709

Granted

2007-12-25

Filed 2004

Owner

INTERNATIONAL BUSINESS MACHINES CORPORATION

AI components

1

hardware

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

10981473

A method (and system) of managing heat in an electrical circuit, includes using a thermal instruction appended to an instruction to be processed to determine a heat load associated with the instruction.

AI hardwareG06F 9/30181G06F 1/206G06F 9/30083G06F 9/30145G06F 9/30167G06F 9/383G06F 9/3885Y02D 10/00

AI classification

AI hardware0.98
Evolutionary computation0.02
Knowledge representation0.01
Natural language0.01
Vision0.00
Speech0.00
Machine learning0.00
Planning0.00

Ownership

INTERNATIONAL BUSINESS MACHINES CORPORATION

assignment · 166550381

Assignors

DANG, HIEN P., SHARMA, ARUN, SRI-JAYANTHA, SRI M.

On an employer assignment, the assignors are typically the inventors.

From the same owner

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