Patent №
US 7,590,952
Granted
2009-09-15
Filed 2006
Owner
INTERNATIONAL BUSINESS MACHINES CORPORATION
Lab
AI components
1
hardware
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
11563704
A computer implemented method, data processing system, and computer usable program code are provided for reducing a chip package model. Responsive to receiving the chip package model, an inductance and a resistance of the chip package model is measured. The inductance and the resistance are measured using only a set of external nodes of the chip package model. A reduced node resistor model and a reduced node inductor model are created using the inductance and the resistance of the chip package model. A combined reduced node resistor-inductor chip package model is formed by combining the reduced node resistor model and reduced node inductor model.
AI classification
Ownership
INTERNATIONAL BUSINESS MACHINES CORPORATION
assignment · 185550206
Assignors
BEATTIE, MICHAEL W., KRAUTER, BYRON L., ZHENG, HUI
On an employer assignment, the assignors are typically the inventors.