METHOD AND DEVICE FOR CONTROLLING TEMPERATURE OF A SUBSTRATE USING AN INTERNAL TEMPERATURE CONTROL DEVICE
Patent №
US 7,671,412
Granted
2010-03-02
Filed 2007
Owner
TOKYO ELECTRON LIMITED
Lab
—
AI components
1
hardware
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
11675210
A substrate, thermal treatment assembly and method of operating the thermal treatment assembly are described for controlling the temperature of a substrate. An electrical potential is applied across two or more locations on the substrate in order to generate an electrical current through a portion of the substrate, thereby altering a temperature of the substrate. The electrical current may dissipate electrical energy in the form of thermal energy due to the intrinsic resistance of the portion of substrate to the flow of electrical current.
AI classification
Ownership
TOKYO ELECTRON LIMITED
assignment · 190100814
Assignors
CARCASI, MICHAEL A., KINCAID, MICHAEL PHILIP
On an employer assignment, the assignors are typically the inventors.