THREE-DIMENSIONAL MASK MODEL FOR PHOTOLITHOGRAPHY SIMULATION

Patent №

US 7,703,069

Granted

2010-04-20

Filed 2007

Owner

BRION TECHNOLOGIES, INC.

Lab

AI components

1

vision

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

11838582

A three-dimensional mask model of the invention provides a more realistic approximation of the three-dimensional effects of a photolithography mask with sub-wavelength features than a thin-mask model. In one embodiment, the three-dimensional mask model includes a set of filtering kernels in the spatial domain that are configured to be convolved with thin-mask transmission functions to produce a near-field image. In another embodiment, the three-dimensional mask model includes a set of correction factors in the frequency domain that are configured to be multiplied by the Fourier transform of thin-mask transmission functions to produce a near-field image.

VisionG06F 30/398G03F 1/36G03F 1/70G03F 7/70441G03F 7/705G06F 30/20G06F 30/33G03F 1/50+6 more

AI classification

Vision1.00
Machine learning0.04
Natural language0.00
Speech0.00
AI hardware0.00
Evolutionary computation0.00
Knowledge representation0.00
Planning0.00

Ownership

BRION TECHNOLOGIES, INC.

assignment · 196930100

Assignors

LIU, PENG, CAO, YU, CHEN, LUOQI, YE, JUN

On an employer assignment, the assignors are typically the inventors.

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