PREDICTING IC MANUFACTURING YIELD BASED ON HOTSPOTS

Patent №

US 7,707,526

Granted

2010-04-27

Filed 2007

Owner

SYNOPSYS, INC.

Lab

AI components

2

evo · hardware

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

11805916

One embodiment of the present invention provides a system that predicts a manufacturing yield of a chip. During operation, the system first receives a chip layout. Next, the system identifies hotspots within the chip layout, wherein a hotspot is a location within the chip layout wherein a yield-indicative variable value falls in a low manufacturable range. The system then obtains yield scores for the hotspots, wherein a yield score indicates a failure probability for a corresponding hotspot. Next, the system predicts the manufacturing yield for the chip based on the hotspots and the yield scores for the hotspots.

AI classification

AI hardware0.81
Evolutionary computation0.80
Machine learning0.30
Planning0.17
Natural language0.04
Knowledge representation0.02
Vision0.00
Speech0.00

Ownership

SYNOPSYS, INC.

assignment · 194120514

Assignors

SU, QING, CHIANG, CHARLES C.

On an employer assignment, the assignors are typically the inventors.

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