Patent №
US 7,954,080
Granted
2011-05-31
Filed 2008
Owner
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Lab
—
AI components
1
planning
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
12042606
A method and system for de-embedding an on-wafer device is disclosed. The method comprises representing the intrinsic characteristics of a test structure using a set of ABCD matrix components; determining the intrinsic characteristics arising from the test structure; and using the determined intrinsic characteristics of the test structure to produce a set of parameters representative of the intrinsic characteristics of a device-under-test (“DUT”).
AI classification
Ownership
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
assignment · 206030262
Assignors
YEN, HSIAO-TSUNG, YEH, TZU-JIN, LIU, SALLY
On an employer assignment, the assignors are typically the inventors.