Patent №
US 7,962,864
Granted
2011-06-14
Filed 2008
Owner
APPLIED MATERIALS, INC.
Lab
—
AI components
2
planning · evo
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
12154458
In one embodiment, a method for predicting yield during the design stage includes receiving defectivity data identifying defects associated with previous wafer designs, and dividing the defects into systematic defects and random defects. For each design layout of a new wafer design, yield is predicted separately for the systematic defects and the random defects. A combined yield is then calculated based on the yield predicted for the systematic defects and the yield predicted for the random defects.
AI classification
Ownership
APPLIED MATERIALS, INC.
assignment · 210570846
Assignors
NEHMADI, YOUVAL, SHIMSHI, RINAT, SVIDENKO, VICKY, SCHWARM, ALEXANDER T., JAWAHARLAL, SUNDAR
On an employer assignment, the assignors are typically the inventors.