STAGE YIELD PREDICTION

Patent №

US 7,962,864

Granted

2011-06-14

Filed 2008

Owner

APPLIED MATERIALS, INC.

Lab

AI components

2

planning · evo

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

12154458

In one embodiment, a method for predicting yield during the design stage includes receiving defectivity data identifying defects associated with previous wafer designs, and dividing the defects into systematic defects and random defects. For each design layout of a new wafer design, yield is predicted separately for the systematic defects and the random defects. A combined yield is then calculated based on the yield predicted for the systematic defects and the yield predicted for the random defects.

AI classification

Planning1.00
Evolutionary computation1.00
Machine learning0.41
Knowledge representation0.06
Natural language0.00
AI hardware0.00
Speech0.00
Vision0.00

Ownership

APPLIED MATERIALS, INC.

assignment · 210570846

Assignors

NEHMADI, YOUVAL, SHIMSHI, RINAT, SVIDENKO, VICKY, SCHWARM, ALEXANDER T., JAWAHARLAL, SUNDAR

On an employer assignment, the assignors are typically the inventors.

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