INTEGRATED CIRCUIT MODELING METHOD AND FRAMEWORK TOOL

Patent №

US 8,205,174

Granted

2012-06-19

Filed 2009

Owner

HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCH INSTITUTE COMPANY LIMITED, A LIMITED LIABILITY COMPANY

Lab

AI components

1

kr

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

12542410

An integrated circuit modeling method 100 implementable on computer, which has an executable software model 145 having modules 140 of reusable functional cores 105 coded in a high level language and a virtual platform of the integrated circuit employable in an architecture exploration step 115. A modeling library of modules coded in high level languages and hardware level languages are provided and instantiated according to user input in a functional verification step 120 having a co-simulation environment, with interface code 170 between modules automatically generated by an interface generator 130 based on a two dimensional data array of hardware specification inputs 205, the interface code 170 further interfacing with wrappers engaged between high and hardware level language modules.

AI classification

Knowledge representation0.97
AI hardware0.28
Planning0.04
Natural language0.01
Machine learning0.00
Vision0.00
Speech0.00
Evolutionary computation0.00

Ownership

HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCH INSTITUTE COMPANY LIMITED, A LIMITED LIABILITY COMPANY

assignment · 233820260

Assignors

LI, SUET FEI, LU, YUNZHAO, OLSSON, ERIK, SHI, MING HUA

On an employer assignment, the assignors are typically the inventors.

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