INSPECTION METHOD FOR SEMICONDUCTOR WAFER AND APPARATUS FOR REVIEWING DEFECTS

Patent №

US 8,309,919

Granted

2012-11-13

Filed 2009

Owner

Lab

AI components

1

vision

Assignment

None on record

Dataset

AIPD

2023_r1 edition

Application

12352357

An object of the present invention is to provide a suitable method of observing a wafer edge by using an electron microscope. The electron microscope includes a column which can take an image in being tilted, and thus allows a wafer edge to be observed from an oblique direction.

VisionG01N 23/2251H01J 37/222H01J 37/244H01J 37/26H01J 37/28H01J 2237/24475H01J 2237/2448H01J 2237/24592+3 more

AI classification

Vision1.00
Evolutionary computation0.01
Knowledge representation0.00
Natural language0.00
Planning0.00
Machine learning0.00
AI hardware0.00
Speech0.00
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