METHOD AND SYSTEM FOR MANUFACTURING SEMICONDUCTOR DEVICES, AND METHOD AND SYSTEM FOR INSPECTING SEMICONDUCTOR DEVICES

Patent №

US 5,801,965

Granted

1998-09-01

Filed 1994

Owner

HITACHI, LTD.

Lab

AI components

3

ml · vision · planning

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

08362763

The present invention relates to a method and system of inspecting a product, including extracting defects from the product, classifying the defects on the basis of information about the extracted defects representing the analogy of the defects, extracting the feature data of the defects on the basis of the result of defect classification, and feeding back the feature data of the extracted defects for inspection. The method and system is characterized in that the extracted feature data of the defects is fed back for inspecting the product. The present invention also relates to a method of manufacturing a semiconductor electric or electronic device, including extracting defects from the semiconductor electric or electronic device, classifying the defects on the basis of information about the extracted defects representing the analogy of the defects, extracting the feature data of the defects on the basis of the result of defect classification, and feeding back the feature data of the extracted defects to an apparatus for manufacturing the semiconductor electric or electronic device.

AI classification

Vision1.00
Planning0.99
Machine learning0.90
AI hardware0.16
Knowledge representation0.03
Natural language0.01
Evolutionary computation0.00
Speech0.00

Ownership

HITACHI, LTD.

assignment · 87130941

Assignors

TAKAGI, YUJI, DOI, HIDEAKI, ONO, MAKOTO

On an employer assignment, the assignors are typically the inventors.

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