METHOD AND SYSTEM FOR MANUFACTURING SEMICONDUCTOR DEVICES, AND METHOD AND SYSTEM FOR INSPECTING SEMICONDUCTOR DEVICES
Patent №
US 5,801,965
Granted
1998-09-01
Filed 1994
Owner
HITACHI, LTD.
Lab
—
AI components
3
ml · vision · planning
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
08362763
The present invention relates to a method and system of inspecting a product, including extracting defects from the product, classifying the defects on the basis of information about the extracted defects representing the analogy of the defects, extracting the feature data of the defects on the basis of the result of defect classification, and feeding back the feature data of the extracted defects for inspection. The method and system is characterized in that the extracted feature data of the defects is fed back for inspecting the product. The present invention also relates to a method of manufacturing a semiconductor electric or electronic device, including extracting defects from the semiconductor electric or electronic device, classifying the defects on the basis of information about the extracted defects representing the analogy of the defects, extracting the feature data of the defects on the basis of the result of defect classification, and feeding back the feature data of the extracted defects to an apparatus for manufacturing the semiconductor electric or electronic device.
AI classification
Ownership
HITACHI, LTD.
assignment · 87130941
Assignors
TAKAGI, YUJI, DOI, HIDEAKI, ONO, MAKOTO
On an employer assignment, the assignors are typically the inventors.