Patent №
US 8,601,411
Granted
2013-12-03
Filed 2012
Owner
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Lab
—
AI components
1
planning
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
13586177
Some embodiments relate to a method for pre-coloring data within an integrated chip layout to avoid overlay errors that result from mask misalignment during multiple patterning lithography. The method may be performed by generating a graphical IC layout file containing an integrated chip layout having a plurality of IC shapes. The IC shapes within the graphical IC layout file are assigned a color during decomposition. The IC shapes are further pre-colored in a manner that deliberately assigns the pre-colored data to a same mask. During mask building data associated with IC shapes that have been pre-colored is automatically sent to a same mask, regardless of the colors that are assigned to the shapes. Therefore, the pre-colored shapes are not assigned to a masked based upon a decomposition, but rather based upon the pre-coloring. By assigning IC shapes to a same mask through pre-coloring, overlay errors can be reduced.
AI classification
Ownership
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
assignment · 287900725
Assignors
CHEN, YEN-HUEI, CHAN, WEI MIN, LIAO, HUNG-JEN, CHANG, JONATHAN TSUNG-YUNG
On an employer assignment, the assignors are typically the inventors.