Method Of Forming An Overmolded Dual In-Line Memory Module Cooling Structure

Patent №

US 8,900,503

Granted

2014-12-02

Filed 2011

Owner

INTERNATIONAL BUSINESS MACHINES CORPORATION

AI components

3

kr · planning · hardware

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

13247275

Methods, apparatuses, and computer program products for forming an overmolded dual in-line memory module (DIMM) cooling structure are provided. Embodiments include identifying, by a tagging module, contextual information indicating circumstances in which the photograph was taken; based on the contextual information, selecting, by the tagging module, candidate profiles from a plurality of friend profiles associated with a profile of a user; and suggesting, by the tagging module to the user, the selected candidate profiles as potential friends to tag in the photograph.

Knowledge representationPlanningAI hardwareB23P 15/26H01L 23/3737H01L 21/565H01L 23/4334H01L 23/473H10W 40/251H10W 40/47H10W 40/778+4 more

AI classification

Planning0.97
Knowledge representation0.87
AI hardware0.51
Machine learning0.08
Vision0.03
Natural language0.01
Evolutionary computation0.00
Speech0.00

Ownership

INTERNATIONAL BUSINESS MACHINES CORPORATION

assignment · 269830181

Assignors

BORAAS, MICHAEL A., KAMATH, VINOD, MILLER, MICHAEL S., STEINKE, MARK E., WAKIL, JAMIL A.

On an employer assignment, the assignors are typically the inventors.

From the same owner

© 2026 NYSGPT2525 LLC