Patent №
US 8,942,840
Granted
—
Owner
—
Lab
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AI components
1
planning
Assignment
None on record
Dataset
AIPD
2023_r1 edition
Application
13743096
A system and method for manufacturing semiconductor devices is disclosed. An embodiment comprises using desired device parameters to choose an initial manufacturing recipe. Once chosen, the initial manufacturing recipe may be modified by determining and applying an offset adjustment based on previous manufacturing to tune the recipes for the particular equipment to be utilized in the manufacturing process.
AI classification
Planning0.98
Machine learning0.38
AI hardware0.29
Knowledge representation0.12
Natural language0.01
Evolutionary computation0.00
Vision0.00
Speech0.00