Integrated Circuit Containing First and Second DOEs of Standard Cell Compatible, NCEM-Enabled Fill Cells, with the First DOE Including Merged-Via Open Configured Fill Cells, and the Second DOE Including Metal Island Open Configured Fill Cells
Patent №
US 9,766,970
Granted
2017-09-19
Filed 2017
Owner
—
Lab
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AI components
1
hardware
Assignment
None on record
Dataset
AIPD
2023_r1 edition
Application
15635259
An IC includes first and second designs of experiments (DOES), each comprised of at least two fill cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The first DOE contains fill cells configured to enable non-contact (NC) detection of merged-via opens, and the second DOE contains fill cells configured to enable NC detection of metal island opens.
AI hardwareH10D 89/10G01R 31/303G06F 30/392G06F 30/398H01L 22/34H10D 1/00H10D 62/115H10D 62/151+22 more
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