Patent №
US 9,873,100
Granted
2018-01-23
Filed 2015
Owner
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Lab
—
AI components
1
hardware
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
14713365
An integrated circuit includes a plurality of sensing pixels. Each sensing pixel of the plurality of sensing pixels includes a sensing film portion, a potential-sensing device configured to generate a first signal responsive to an electrical characteristic of the sensing film portion, a temperature-sensing device configured to generate a second signal responsive to a temperature of the sensing film portion, and one or more heating elements configured to adjust the temperature of the sensing film portion.
AI classification
Ownership
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
assignment · 356490442
Assignors
CHEN, TUNG-TSUN, LIU, YI-SHAO, HUANG, JUI-CHENG, WEN, CHIN-HUA, TSUI, FELIX YING-KIT, PENG, YUNG-CHOW
On an employer assignment, the assignors are typically the inventors.