INTEGRATED CIRCUIT MODELING METHOD USING RESISTIVE CAPACITANCE INFORMATION

Patent №

US 9,996,643

Granted

2018-06-12

Filed 2014

Owner

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Lab

AI components

1

hardware

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

14543352

A method of modeling an integrated circuit comprises generating a schematic of an integrated circuit comprising a first circuit component. The schematic comprises a first representation of the first circuit component. The method also comprises replacing the first representation with a second representation of the first circuit component. The second representation includes resistive capacitance information (RC) for the first circuit component. The RC information is based on first RC data included in a process design kit (PDK) file and second RC data included in a macro device file. The second RC data is based on a relationship between the first circuit component and a second circuit component. The method further comprises selectively coloring the second representation of the first circuit component in the schematic based on the RC information. The coloring of the second representation is indicative of whether the integrated circuit is in compliance with a design specification.

AI hardwareG06F 30/3308G06F 30/30G06F 30/33G06F 2111/04G06F 2111/12

AI classification

AI hardware0.66
Planning0.32
Vision0.28
Evolutionary computation0.00
Speech0.00
Knowledge representation0.00
Natural language0.00
Machine learning0.00

Ownership

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

assignment · 341890956

Assignors

CHEN, CHIN-SHENG, YANG, TSUN-YU, HU, WEI-YI, KUAN, JUI-FENG, YANG, CHING-SHUN

On an employer assignment, the assignors are typically the inventors.

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