Patent №
US 11,614,684
Granted
2023-03-28
Filed 2021
Owner
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Lab
—
AI components
2
vision · planning
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
17200867
A method includes: receiving a photomask; patterning a wafer by directing a first radiation beam to the wafer through the photomask at a first tilt angle; and inspecting the photomask. The inspecting includes: directing a second radiation beam to the photomask at a second tilt angle greater than the first tilt angle; receiving a third radiation beam reflected from the photomask; and generating an image of the photomask according to the third radiation beam.
AI classification
Ownership
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
assignment · 555840682
Assignors
WEN, CHIH-WEI, TSENG, HSIN-FU, CHEN, CHIEN-LIN
On an employer assignment, the assignors are typically the inventors.