ALIGNMENT METHOD AND METHOD FOR PRODUCING DEVICE USING THE ALIGNMENT METHOD

An alignment method for aligning each shot area on a photosensitive substrate with a reticle according to array coordinate predicted by a statistical technique with an improved alignment precision without inviting degradation of throughput, wherein a plurality of alignment marks 29-1, 30-1, 34-1, 35-1 in a short area 27-1 and so forth provided on the n-th wafer 8 (1≦n≦N−1) are measured to carry out the alignment of the shot area with the reticle considering the misalignment of the wafer 8 and the distortion of the shot area 27-1 and so forth, and one alignment mark in a shot are 27-1 or another provided on the (n+k)th wafer 8 (1≦k≦N−n) is measured to carry out the alignment of the shot area with the reticle considering the misalignment of the wafer 8 found from the measurement results, and the distortion of the shot area 27-1 and so forth obtained when the nth wafer 8 is processed.