SYSTEM AND METHOD FOR MONITORING AND IMPROVING DIMENSIONAL STABILITY AND REGISTRATION ACCURACY OF MULTI-LAYER PCB MANUFACTURE

Targets are inserted throughout the layout of a PCB. Post manufacture measurement of the targets are compared to pre-manufacture positions so as to calculate a non-linear regression analysis best fit model. This model is used to predict a feature's location upon or within a PCB given the feature's position on the layout. The non-linear regression analysis results in a set of x and y polynomial equations. These polynomial equations allows for a linear compensation to be applied to the feature position on a layout so as to minimize misregistration of features in the manufacture of PCBs. Models of the features' post production positioning is made before and after linear compensations are made to the pre-manufacture positioning of the features. Graphical presentations using wire frame diagrams and color coded diagrams help identify those areas of the panel that are projected to be in and out of tolerance relative to the specifications.