Patent №
US 6,724,928
Granted
2004-04-20
Filed 2000
Owner
ADVANCED MICRO DEVICES
Lab
—
AI components
1
vision
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
09496532
Post-manufacturing analysis of a semiconductor chip is enhanced via a method and system for viewing emissions through substrate in the back side of the chip. According to an example embodiment of the present invention, a portion of circuitry in a semiconductor chip is excited, and an emission is generated. An optical microscope is directed at the backside of the chip, and an image of the emission is obtained. The optical microscope is coupled to an indium-gallium-arsenic (InGaAs) camera that is used to detect the emission. In this manner, emissions can be detected through substrate in a semiconductor chip.
AI classification
Ownership
ADVANCED MICRO DEVICES
assignment · 106010646
Assignors
DAVIS, BRENNAN V.
On an employer assignment, the assignors are typically the inventors.