SYSTEM AND SOFTWARE FOR DATA DISTRIBUTION IN SEMICONDUCTOR MANUFACTURING AND METHOD THEREOF

Patent №

US 6,772,034

Granted

2004-08-03

Filed 2001

Owner

ADVANCED MICRO DEVICES, INC.

Lab

AI components

1

planning

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

09905226

A method is presented wherein an engineering data collection (EDC) subsystem of a process control system as embodied is responsible for configuring data collection, distributing collected data, and storing collected data, and is supported through underlying interfaces in a transaction and performance monitoring system. In an embodiment, an engineering data collection (EDC) broker accepts data from equipment interfaces or a tap subsystem, then distributes the data to all subscribers such as data history, the engineering data analysis (EDA) system interface, and the statistical process control (SPC) subsystem as disclosed herein. Engineering data analysis system interface is responsible for transmitting raw data and process control system data to engineering data analysis system. Data history subscribes to all data and stores it in the transaction and performance monitoring system's online transaction processing (OLTP) database. User input to engineering data collection subsystem is accomplished via web interface or a keyboard data entry client.

PlanningG05B 19/4188G05B 2219/31395G05B 2219/32191G05B 2219/33149Y02P 90/02

AI classification

Planning1.00
Knowledge representation0.38
Vision0.00
Machine learning0.00
Natural language0.00
AI hardware0.00
Speech0.00
Evolutionary computation0.00

Ownership

ADVANCED MICRO DEVICES, INC.

assignment · 120070749

Assignors

SHI, YURONG, LIKES, DONALD C., BROWN, RUSSELL C.

On an employer assignment, the assignors are typically the inventors.

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