CMOS IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME

Patent №

US 7,339,155

Granted

2008-03-04

Filed 2005

Owner

DONGBUANAM SEMICONDUCTOR INC.

Lab

AI components

1

vision

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

11320767

A CMOS image sensor and a method for fabricating the same are disclosed, in which light-shielding layers are formed in trenches to improve photosensitivity of the image sensor and simplify its process steps. The CMOS image sensor includes a plurality of photodiodes formed in a semiconductor substrate at constant intervals, an interlayer dielectric layer formed on the semiconductor substrate including the photodiodes, a plurality of metal lines formed in the interlayer dielectric layer, a plurality of light-shielding layers formed in the interlayer dielectric layer to correspond to the metal lines, and microlenses formed over the interlayer dielectric layer to correspond to portions between the respective light-shielding layers.

VisionH10F 39/024H10F 39/8057H10F 39/18H10F 39/803H10F 39/8053H10F 39/8063

AI classification

Vision0.90
Natural language0.00
AI hardware0.00
Machine learning0.00
Evolutionary computation0.00
Speech0.00
Knowledge representation0.00
Planning0.00

Ownership

DONGBUANAM SEMICONDUCTOR INC.

assignment · 174310825

Assignors

LEE, SANG GI

On an employer assignment, the assignors are typically the inventors.

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