Oversized Contacts and Vias in Layout Defined by Linearly Constrained Topology

Patent №

US 9,711,495

Granted

2017-07-18

Filed 2016

Owner

—

Lab

—

AI components

hardware

Assignment

None on record

Dataset

AIPD

2023_r1 edition

Application

15243886

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A rectangular-shaped interlevel connection layout structure is defined to electrically connect a first layout structure in a first chip level with a second layout structure in a second chip level. The rectangular-shaped interlevel connection layout structure is defined by an as-drawn cross-section having at least one dimension larger than a corresponding dimension of either the first layout structure, the second layout structure, or both the first and second layout structures. A dimension of the rectangular-shaped interlevel connection layout structure can exceed a normal maximum size in one direction in exchange for a reduced size in another direction. The rectangular-shaped interlevel connection layout structure can be placed in accordance with a gridpoint of a virtual grid defined by two perpendicular sets of virtual lines. Also, the first and/or second layout structures can be spatially oriented and/or placed in accordance with one or both of the two perpendicular sets of virtual lines.

AI hardwareH01L 23/5226H10D 89/10G03F 1/36H01L 23/528H10D 64/518H10D 84/0135H10D 84/0149H10D 84/038+8 more

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Cites (127)

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