Patent №
US 6,701,259
Granted
2004-03-02
Filed 2001
Owner
APPLIED MATERIALS, INC.
Lab
—
AI components
1
planning
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
09905607
A method and associated apparatus of analyzing defects on semiconductor wafers. The method includes identifying defects on the semiconductor wafer. Defect inspection information is created within a defect source identifier client. The defect inspection information containing information regarding the identified defects. The defect inspection information is transmitted through a network to a defect source identifier server. Defect source information is derived at the defect source identifier server in response to the defect inspection information. The defect source information is transmitted from the defect source identifier server to the defect source identifier client. The defect source information is utilized at the defect source identifier client. In one aspect, the utilizing the defect solution information involves displaying defect solutions to the defect at the defect source identifier client in response to the defect solution information. In another aspect, utilizing the defect solution information involves altering the operation of the wafer processing system.
AI classification
Ownership
APPLIED MATERIALS, INC.
assignment · 120170263
Assignors
DOR, AMOS, RADZINSKI, MAYA
On an employer assignment, the assignors are typically the inventors.