METHOD AND APPARATUS FOR PREDICTING ELECTRICAL PARAMETERS USING MEASURED AND PREDICTED FABRICATION PARAMETERS
Patent №
US 6,917,849
Granted
2005-07-12
Filed 2002
Owner
ADVANCED MICRO DEVICES, INC.
Lab
—
AI components
1
planning
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
10323543
A method includes collecting a first fabrication parameter associated with the processing of a selected semiconductor device. A second fabrication parameter is estimated for the selected semiconductor device. A first value for at least one electrical characteristic of the selected semiconductor device is predicted based on the collected first fabrication parameter and the estimated second fabrication parameter. A system includes a data collection unit and a prediction unit. The data collection unit is configured to collect a first fabrication parameter associated with the processing of a selected semiconductor device. The prediction unit is configured to estimate a second fabrication parameter for the selected semiconductor device and predict a first value for at least one electrical characteristic of the selected semiconductor device based on the collected first fabrication parameter and the estimated second fabrication parameter.
AI classification
Ownership
ADVANCED MICRO DEVICES, INC.
assignment · 135980455
Assignors
PASADYN, ALEXANDER J., SONDERMAN, THOMAS J.
On an employer assignment, the assignors are typically the inventors.