METHOD AND APPARATUS FOR PREDICTING ELECTRICAL PARAMETERS USING MEASURED AND PREDICTED FABRICATION PARAMETERS

Patent №

US 6,917,849

Granted

2005-07-12

Filed 2002

Owner

ADVANCED MICRO DEVICES, INC.

Lab

AI components

1

planning

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

10323543

A method includes collecting a first fabrication parameter associated with the processing of a selected semiconductor device. A second fabrication parameter is estimated for the selected semiconductor device. A first value for at least one electrical characteristic of the selected semiconductor device is predicted based on the collected first fabrication parameter and the estimated second fabrication parameter. A system includes a data collection unit and a prediction unit. The data collection unit is configured to collect a first fabrication parameter associated with the processing of a selected semiconductor device. The prediction unit is configured to estimate a second fabrication parameter for the selected semiconductor device and predict a first value for at least one electrical characteristic of the selected semiconductor device based on the collected first fabrication parameter and the estimated second fabrication parameter.

PlanningH01L 22/20H10P 74/23

AI classification

Planning0.99
Machine learning0.02
Knowledge representation0.01
AI hardware0.01
Natural language0.00
Vision0.00
Evolutionary computation0.00
Speech0.00

Ownership

ADVANCED MICRO DEVICES, INC.

assignment · 135980455

Assignors

PASADYN, ALEXANDER J., SONDERMAN, THOMAS J.

On an employer assignment, the assignors are typically the inventors.

© 2026 NYSGPT2525 LLC