INTEGRATED PROCESSING AND L2 DRAM CACHE

Patent №

US 5,895,487

Granted

1999-04-20

Filed 1996

Owner

IBM CORPORATION

AI components

1

hardware

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

08748300

An integrated processor and level two (L2) dynamic random access memory (DRAM) are fabricated on a single chip. As an extension of this basic structure, the invention also contemplates multiprocessor "node" chips in which multiple processors are integrated on a single chip with L2 cache. By integrating the processor and L2 DRAM cache on a single chip, high on-chip bandwidth, reduced latency and higher performance are achieved. A multiprocessor system can be realized in which a plurality of processors with integrated L2 DRAM cache are connected in a loosely coupled multiprocessor system. Alternatively, the single chip technology can be used to implement a plurality of processors integrated on a single chip with an L2 DRAM cache which may be either private or shared. This approach overcomes a number of issues which limit the performance and cost of a memory hierarchy. When the L2 DRAM cache is placed on the same chip as the processor, the time needed for two chip-to-chip crossings is eliminated. Since these crossings require off-chip drivers and receivers and must be synchronized with the system clock, the time involved is substantial. This means that with the integrated L2 DRAM cache, latency is reduced.

AI hardwareG06F 12/0817G06F 12/0851G06F 12/0897G06F 12/1045G06F 15/7846G06F 12/1054G06F 12/1063Y02D 10/00

AI classification

AI hardware0.74
Natural language0.01
Machine learning0.00
Planning0.00
Evolutionary computation0.00
Knowledge representation0.00
Speech0.00
Vision0.00

Ownership

IBM CORPORATION

assignment · 83090650

Assignors

BOYD, WILLIAM T. BOYD, HELLER, THOMAS J. JR., IGNATOWSKI, MICHAEL, MATICK, RICHARD E., SCHUSTER, STANLEY E.

On an employer assignment, the assignors are typically the inventors.

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