Patent №
US 5,895,487
Granted
1999-04-20
Filed 1996
Owner
IBM CORPORATION
Lab
AI components
1
hardware
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
08748300
An integrated processor and level two (L2) dynamic random access memory (DRAM) are fabricated on a single chip. As an extension of this basic structure, the invention also contemplates multiprocessor "node" chips in which multiple processors are integrated on a single chip with L2 cache. By integrating the processor and L2 DRAM cache on a single chip, high on-chip bandwidth, reduced latency and higher performance are achieved. A multiprocessor system can be realized in which a plurality of processors with integrated L2 DRAM cache are connected in a loosely coupled multiprocessor system. Alternatively, the single chip technology can be used to implement a plurality of processors integrated on a single chip with an L2 DRAM cache which may be either private or shared. This approach overcomes a number of issues which limit the performance and cost of a memory hierarchy. When the L2 DRAM cache is placed on the same chip as the processor, the time needed for two chip-to-chip crossings is eliminated. Since these crossings require off-chip drivers and receivers and must be synchronized with the system clock, the time involved is substantial. This means that with the integrated L2 DRAM cache, latency is reduced.
AI classification
Ownership
IBM CORPORATION
assignment · 83090650
Assignors
BOYD, WILLIAM T. BOYD, HELLER, THOMAS J. JR., IGNATOWSKI, MICHAEL, MATICK, RICHARD E., SCHUSTER, STANLEY E.
On an employer assignment, the assignors are typically the inventors.